COMPOUND HEAT SINK
COMPUTER AND ACCESSORIES
SenseLK
Rs 200
In Stock
Available hours
Closed now
- Monday09:00 - 19:00
- Tuesday09:00 - 19:00
- Wednesday09:00 - 19:00
- Thursday09:00 - 19:00
- Friday09:00 - 19:00
- SaturdayToday09:00 - 19:00
- Sunday09:00 - 17:00
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Description
| Feature | Details |
|---|---|
| Product Name | Compound Heat Sink |
| Type | Thermal Grease / Heat Sink Compound |
| Net Weight | 0.5g |
| Composition | Silicone fluid with 20% Zinc Oxide |
| Color | Grey |
| Thermal Conductivity | >1.22 W/m-K |
| Thermal Resistance | >0.201 C-in²/W |
| Dielectric Breakdown | >5.0 KV AC |
| Compatibility | CPU, VGA fans, GPU chips |
| Safety | Non-toxic, safe for electronics |
| Application | Easy to apply to processors and heat sinks |
| Usage | Improves heat dissipation, prevents overheating |
Product Highlights
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Efficient Heat Dissipation: High thermal conductivity ensures rapid heat transfer.
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Safe Formula: Non-toxic silicone and zinc oxide combination protects your hardware.
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Compact & Lightweight: 0.5g tube provides precise application without waste.
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High Dielectric Strength: >5.0 KV AC ensures safe operation near electronics.
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Versatile Use: Ideal for CPUs, VGA, and GPU fans for better cooling.
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Low Thermal Resistance: Minimizes temperature rise and improves hardware performance.
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Easy Application: Smooth and spreadable, ensuring perfect contact between chip and heatsink.
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